New OCP Interposers from SerialTek
Oct 15, 2025
SerialTek Launches OCP-Compliant PCIe 6.0 & CXL Interposer to Accelerate Hyperscale AI/ML Performance
New SI-Fi™-Powered Accessory Delivers Protocol and Power Analysis for OCP NICs and SSDs at 64 GT/s
SerialTek, a leading provider of protocol test and analysis solutions for PCI Express® (PCIe®) and Compute Express Link™ (CXL®), has launched its next-generation Open Compute Project-compliant (OCP) interposer solution. The new interposer is engineered for PCIe 6.0 and CXL 3.0 at 64 GT/s, delivering high-fidelity signal capture and advanced power analysis across OCP NIC 3.0 and EDSFF form factors. Hyperscale engineers depend on SerialTek’s solutions to validate the performance and reliability of next-generation data centers and AI/ML infrastructure.
“Our OCP NIC 3.0 interposer brings PCIe Gen6 and CXL 3.x visibility directly into the OCP ecosystem.”
— SerialTek CEO Paul Mutschler
Seamlessly integrating with SerialTek’s Kodiak™ Advanced Protocol Test and Analysis System, the new interposer packages use SerialTek’s proprietary SI-Fi™ (Signal Integrity Fidelity) technology—engineered for ultra-low loss and transparent signal tapping—to deliver unmatched signal fidelity in high-speed capture. When paired with Quarch’s Power Analysis Module, the system provides synchronized protocol and power data, critical for debugging, optimization, and compliance testing. SerialTek CEO Paul Mutschler said, “Our OCP NIC 3.0 interposer brings PCIe Gen6 and CXL 3.x visibility directly into the OCP ecosystem. It’s engineered for the unique signal and mechanical challenges of OCP NIC 3.0 and EDSFF designs, giving engineers the fidelity and form-factor precision needed to validate next-generation hyperscale and AI platforms.”