Date and time
April 5-6 2023, 9:00 AM – 4:00 PM EDT
Location
The Westin Southfield Detroit
Presenters:
Ellisys | SerialTek | Quarch | Unigraf | Signature IP
Synopsys | Bluetooth SIG | DENSO | Renesas | Rohde & Schwarz | Novel Bits | UNH-IOL
Overview:
Join us for two days of wide-ranging presentations on the latest tools, techniques, and trends delivered by an all-star lineup of industry technology leaders, including standards organizations, test equipment manufacturers, and automotive silicon & IP developers.
This no-cost event, hosted by Symbiosys Alliance, is open to professionals working in the automotive industry, including OEMs and Tier 1 suppliers. Content is designed for engineers, technicians, marketing staff, and managers from engineering and manufacturing disciplines.
This seminar is a great opportunity for peer networking and 1:1 discussions on the latest technology specifications, the coming additions to those specifications, market trends, silicon availability and functionalities, and the advanced protocol and RF test tools that make it all happen.
Includes sideline exhibits featuring sponsors’ products and services.
Classroom setup with continental breakfast and buffet lunch provided.
Event parking is free.
AGENDA
Day 1
Bluetooth and other wireless technologies
8:00 AM | Registration (continental breakfast served) |
9:00 AM | Welcome Presentation |
9:05 AM | Introduction to Bluetooth LE Development in Automotive Applications presented by Mohammad Afaneh, Novel Bits |
9:45 AM | Connected Vehicles Using Renesas Bluetooth LE Devices presented by David Lara, Renesas |
10:30 AM | Exhibits / Coffee Break |
11:00 AM | Highly Accurate and Secure Distance Measurement using Bluetooth® Technology presented by Henry Wong, Bluetooth SIG with Paul Skentzos and Kyle Golsch, DENSO |
12:15 PM | Lunch Buffet |
1:00 PM | The Evolving Role of Bluetooth in Automotive and Related Testing Challenges presented by Chuck Trefts, Ellisys |
1:45 PM | 5 Min Break |
1:50 PM | Bluetooth LE Technology Evolution and How to Test These Devices presented by Clark Conrad, Rohde & Schwarz |
2:30 PM | Exhibits / Coffee Break |
3:00 PM | Bluetooth IP – Accelerating future Automotive Electronic Applications presented by Charles Dittmer, Synopsys |
3:45 PM | Closing Presentation |
Day 2
PCIe, DisplayPort, Power Analysis, Fault Injection, and Ethernet
8:00 AM | Registration (continental breakfast served) |
9:00 AM | Welcome Presentation |
9:05 AM | Automotive Power Analysis, Including EV Applications presented by Michael Dearman, Quarch Technology |
9:50 AM | 5 Min Break |
9:55 AM | Single Pair Ethernet and Time Sensitive Networking Testing and Challenges presented by Bob Noseworthy, University of New Hampshire’s InterOperability Lab |
10:40 AM | Exhibits / Coffee Break |
11:15 AM | Automotive Ethernet Technology Evolution and How to Test These Devices presented by Mike Schnecker, Rohde & Schwarz |
12:00 PM | Lunch Buffet |
12:45 PM | DisplayPort Solutions for Automotive Applications presented by Juan Calderon, Unigraf |
1:25 PM | 5 Min Break |
1:30 PM | Physical layer fault injection (LAN, PCIE, Ethernet) presented by Michael Dearman, Quarch Technology |
2:15 PM | Exhibits / Coffee Break |
2:45 PM | A Scalable, Configurable, Resilient Network-on-Chip (NoC) for Complex SoC and Chiplet-based Systems presented by Parag Bhatt, Signature IP |
3:15 PM | PCIe for Automotive Applications presented by Simon Thomas, SerialTek |
3:45 PM | Closing Presentation |
Registration has closed, but please check back for future events.